This paper deals with an optimization approach of 3D space placement of power components under volume and thermal constraints. It consists in optimizing semiconductors positions on a heat sink by respecting the components junction temperatures and minimizing the heat sink size. The aim is to remove risks on the 3D converter components placement and ensure their effective integration before carrying out the first physical prototype. This approach is based on coupling an optimization environment with a thermal finite element simulation tool. A pre-sizing step using analytical models is performed to set the optimization computations coupled to numerical simulation.